kernel.git/drivers/thermal, branch linux-rolling-lts

thermal: int340x: Fix sysfs group leak on DLVR registration failure

2026-03-04T12:20:38Z

[ Upstream commit 15176b818e048ccf6ef4b96db34eda7b7e98938a ] When DLVR sysfs group creation fails in proc_thermal_rfim_add(), the function returns immediately without cleaning up the FIVR group that may have been created earlier. Add proper error unwinding to remove the FIVR group before returning failure. Signed-off-by: Kaushlendra Kumar Acked-by: Srinivas Pandruvada Link: https://patch.msgid.link/LV3PR11MB876881B77D32A2854AD2908EF563A@LV3PR11MB8768.namprd11.prod.outlook.com Signed-off-by: Rafael J. Wysocki Signed-off-by: Sasha Levin

thermal/of: Fix reference leak in thermal_of_cm_lookup()

2026-02-26T22:59:00Z

[ Upstream commit a1fe789a96fe47733c133134fd264cb7ca832395 ] In thermal_of_cm_lookup(), tr_np is obtained via of_parse_phandle(), but never released. Use the __free(device_node) cleanup attribute to automatically release the node and fix the leak. Fixes: 423de5b5bc5b ("thermal/of: Fix cdev lookup in thermal_of_should_bind()") Signed-off-by: Felix Gu Reviewed-by: Lukasz Luba [ rjw: Changelog edits ] Link: https://patch.msgid.link/20260124-thermal_of-v1-1-54d3416948cf@gmail.com Signed-off-by: Rafael J. Wysocki Signed-off-by: Sasha Levin

thermal: intel: x86_pkg_temp_thermal: Handle invalid temperature

2026-02-26T22:59:00Z

[ Upstream commit 9635c586a559ba0e45b2bfbff79c937ddbaf1a62 ] After commit be0a3600aa1e ("thermal: sysfs: Rework the handling of trip point updates"), THERMAL_TEMP_INVALID can be passed to sys_set_trip_temp() and it is treated as a regular temperature value there, so the sysfs write fails even though it is expected to succeed and disable the given trip point. Address this by making sys_set_trip_temp() clear its temp variable when it is equal to THERMAL_TEMP_INVALID. Fixes: be0a3600aa1e ("thermal: sysfs: Rework the handling of trip point updates") Signed-off-by: Rafael J. Wysocki Link: https://patch.msgid.link/2815400.mvXUDI8C0e@rafael.j.wysocki Signed-off-by: Sasha Levin

thermal: renesas: Fix RZ/G3E fall-out

2025-10-02T08:41:58Z

- Restore sort order in MAINTAINERS and Kconfig, - Remove empty trailing line from Makefile. Fixes: 19d3a401a617c68e ("thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC") Signed-off-by: Geert Uytterhoeven Signed-off-by: Rafael J. Wysocki

Merge tag 'thermal-v6.18-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux

2025-09-28T10:01:58Z

Merge a thermal driver fix for 6.18 from Daniel Lezcano: "- Add missing file when importing conflicting change for the Renesas RZ/G3E thermal driver (Daniel Lezcano)" * tag 'thermal-v6.18-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: thermal/drivers/renesas/rzg3e: Fix add thermal driver for the Renesas RZ/G3E SoC

thermal/drivers/renesas/rzg3e: Fix add thermal driver for the Renesas RZ/G3E SoC

2025-09-27T22:19:53Z

When applied the change commit 19d3a401a617, a conflict appeared resulting into a manual fix. However the new file rzg3e_thermal.c was not added but stayed locally in source tree and miss to be merged with the entire change. Fix this by adding the file back. Fixes: 19d3a401a617 ("Add thermal driver for the Renesas RZ/G3E SoC") Reported-by: kernel test robot Closes: https://lore.kernel.org/oe-kbuild-all/202509272225.sARVqv2G-lkp@intel.com Signed-off-by: John Madieu Signed-off-by: Daniel Lezcano

Merge tag 'thermal-v6.18-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux

2025-09-26T20:01:13Z

Merge updates of thermal drivers for 6.18-rc1 from Daniel Lezcano: "- Add the QCS615 compatible DT bindings for QCom platforms (Gaurav Kohli) - Support fallback trimming values when the fuse is empty in the R-Car driver (Marek Vasut) - Remove unneeded semicolon in the Mediatek LVTS driver (Jiapeng Chong) - Fix the LMH Kconfig option by selecting QCOM_SCM and take the opportunity to add the COMPILE_TEST option for the QCom's LMH feature (Dmitry Baryshkov) - Fix the missing includes and incorrect error message in the Qcom's LMH driver (Dmitry Baryshkov) - Fix comment typo and add the documentation in the Kconfig for the R-Car Gen3 and Gen4 (Marek Vasut) - Add Tegra114 SOCTHERM support (Svyatoslav Ryhel) - Rename the functions name in the driver to be consistent and generic with the different R-Car platform variants (Wolfram Sang) - Register the TI K3 J72xx bandgap sensor as a hwmon sensor too (Michael Walle) - Add and document the thermal sensor unit reporting the junction temperature of the RZ/G3S SoC (Claudiu Beznea) - Support the GRF in the Rockchip driver (Sebastian Reichel) - Add a temperature IIO sensor channel in the generic thermal ADC driver (Svyatoslav Ryhel) - Document the temperature sensor on the QCOM's Glymur platform (Manaf Meethalavalappu) - Add and document the thermal sensor unit reporting the junction temperature of the RZ/G3E SoC (John Madieu)" * tag 'thermal-v6.18-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (24 commits) dt-bindings: thermal: qcom-tsens: Document the Glymur temperature Sensor thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC dt-bindings: thermal: r9a09g047-tsu: Document the TSU unit thermal/drivers/thermal-generic-adc: Add temperature sensor channel dt-bindings: thermal: rockchip: Tighten grf requirements thermal/drivers/rockchip: Shut up GRF warning thermal/drivers/rockchip: Unify struct rockchip_tsadc_chip format thermal/drivers/renesas/rzg3s: Add thermal driver for the Renesas RZ/G3S SoC dt-bindings: thermal: r9a08g045-tsu: Document the TSU unit thermal/drivers/k3_j72xx_bandgap: Register sensors with hwmon thermal/drivers/rcar_gen3: Fix mapping SoCs to generic Gen4 entry thermal/drivers/tegra: Add Tegra114 specific SOCTHERM driver dt-bindings: thermal: add Tegra114 soctherm header thermal/drivers/tegra/soctherm-fuse: Prepare calibration for Tegra114 support dt-bindings: thermal: Document Tegra114 SOCTHERM Thermal Management System thermal/drivers/rcar_gen3: Document Gen4 support in Kconfig entry thermal/drivers/rcar_gen3: Fix comment typo drivers/thermal/qcom/lmh: Fix incorrect error message thermal/drivers/qcom/lmh: Add missing IRQ includes thermal/drivers/qcom: Make LMH select QCOM_SCM ...

Merge branch 'thermal-intel'

2025-09-26T19:49:58Z

Merge an adjustment of the new Power Slider interface in the int340x thermal driver. * thermal-intel: thermal: intel: int340x: Power Slider: Validate slider_balance range

thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC

2025-09-25T20:11:00Z

The RZ/G3E SoC integrates a Temperature Sensor Unit (TSU) block designed to monitor the chip's junction temperature. This sensor is connected to channel 1 of the APB port clock/reset and provides temperature measurements. It also requires calibration values stored in the system controller registers for accurate temperature measurement. Add a driver for the Renesas RZ/G3E TSU. [ dlezcano: Fixed conflict with "renesas: Add support for RZ/G3S" ] Signed-off-by: John Madieu Reviewed-by: Biju Das Link: https://lore.kernel.org/r/20250917170202.197929-3-john.madieu.xa@bp.renesas.com Signed-off-by: Daniel Lezcano

thermal/drivers/thermal-generic-adc: Add temperature sensor channel

2025-09-25T20:11:00Z

To avoid duplicating sensor functionality and conversion tables, this design allows converting an ADC IIO channel's output directly into a temperature IIO channel. This is particularly useful for devices where hwmon isn't suitable or where temperature data must be accessible through IIO. One such device is, for example, the MAX17040 fuel gauge. Signed-off-by: Svyatoslav Ryhel Reviewed-by: Jonathan Cameron Link: https://lore.kernel.org/r/20250903162749.109910-2-clamor95@gmail.com Signed-off-by: Daniel Lezcano