kernel.git/drivers/thermal/samsung, branch linux-6.4.y

thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers

2023-03-03T19:45:02Z

The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano Reviewed-by: Niklas Söderlund #R-Car Acked-by: Mark Brown Reviewed-by: AngeloGioacchino Del Regno #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI #Mediatek lvts Reviewed-by: Adam Ward #da9062 Reviewed-by: Baolin Wang #spread Acked-by: Jernej Skrabec #sun8i_thermal Acked-by: Rafael J. Wysocki Acked-by: Florian Fainelli #Broadcom Reviewed-by: Dhruva Gole # K3 bandgap Acked-by: Linus Walleij Acked-by: Heiko Stuebner #rockchip Reviewed-by: Kunihiko Hayashi #uniphier Signed-off-by: Rafael J. Wysocki

thermal: Remove core header inclusion from drivers

2023-02-15T16:29:48Z

As the name states "thermal_core.h" is the header file for the core components of the thermal framework. Too many drivers are including it. Hopefully the recent cleanups helped to self encapsulate the code a bit more and prevented the drivers to need this header. Remove this inclusion in every place where it is possible. Some other drivers did a confusion with the core header and the one exported in linux/thermal.h. They include the former instead of the latter. The changes also fix this. The tegra/soctherm driver still remains as it uses an internal function which need to be replaced. The Intel HFI driver uses the netlink internal framework core and should be changed to prevent to deal with the internals. No functional changes intended. Signed-off-by: Daniel Lezcano Reviewed-by: Miquel Raynal # armada_thermal.c Reviewed-by: Kunihiko Hayashi # uniphier_thermal.c Reviewed-by: Niklas Söderlund # rcar_gen3_thermal.c Reviewed-by: Neil Armstrong # amlogic_thermal.c Acked-by: Florian Fainelli # bcm2835_thermal.c Acked-by: Thierry Reding # tegra30-tsensor.c Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org Signed-off-by: Rafael J. Wysocki

thermal/drivers/exynos: Fix NULL pointer dereference when getting the critical temp

2023-01-06T13:14:48Z

The driver is assuming the get_critical temperature exists as it is inherited by the thermal of ops. But this one has been removed in favor of the generic one. Use the generic thermal_zone_get_crit_temp() function instead Fixes: 13bea86623be ("thermal/of: Remove of_thermal_get_crit_temp(") Reported-by: Marek Szyprowski Reviewed-by: Krzysztof Kozlowski Tested-by: Marek Szyprowski Signed-off-by: Daniel Lezcano

thermal/drivers/exynos: Replace of_thermal_is_trip_valid() by thermal_zone_get_trip()

2023-01-06T13:14:47Z

The thermal_zone_get_trip() does the same check as of_thermal_is_trip_valid(). Replace the call to of_thermal_is_trip_valid() by thermal_zone_get_trip(). Signed-off-by: Daniel Lezcano Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20221003092602.1323944-10-daniel.lezcano@linaro.org

thermal/drivers/exynos: of_thermal_get_ntrips()

2023-01-06T13:14:47Z

The thermal core framework allows to get the number of thermal trips, use it instead of visiting the thermal core structure internals. Signed-off-by: Daniel Lezcano Reviewed-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20221003092602.1323944-9-daniel.lezcano@linaro.org

thermal/drivers/exynos: Use generic thermal_zone_get_trip() function

2023-01-06T13:14:47Z

The thermal framework gives the possibility to register the trip points with the thermal zone. When that is done, no get_trip_* ops are needed and they can be removed. Convert ops content logic into generic trip points and register them with the thermal zone. Signed-off-by: Daniel Lezcano Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20221003092602.1323944-8-daniel.lezcano@linaro.org

thermal/drivers/samsung: Switch to new of thermal API

2022-08-17T12:09:39Z

The thermal OF code has a new API allowing to migrate the OF initialization to a simpler approach. The ops are no longer device tree specific and are the generic ones provided by the core code. Convert the ops to the thermal_zone_device_ops format and use the new API to register the thermal zone with these generic ops. Signed-off-by: Daniel Lezcano Reviewed-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20220804224349.1926752-32-daniel.lezcano@linexp.org Signed-off-by: Daniel Lezcano

thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()

2021-08-14T10:40:35Z

This error path return success but it should propagate the negative error code from devm_clk_get(). Fixes: 6c247393cfdd ("thermal: exynos: Add TMU support for Exynos7 SoC") Signed-off-by: Dan Carpenter Reviewed-by: Krzysztof Kozlowski Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20210810084413.GA23810@kili

thermal: exynos: Silence warning during deferred probe

2020-03-12T10:56:53Z

Don't confuse user with meaningless warning about the failure of registering sensors in case of deferred probe. Signed-off-by: Marek Szyprowski Reviewed-by: Amit Kucheria Acked-by: Bartlomiej Zolnierkiewicz Reviewed-by: Krzysztof Kozlowski Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20200228092331.21548-1-m.szyprowski@samsung.com

thermal: exynos: Rename Samsung and Exynos to lowercase

2020-01-27T09:24:32Z

Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org