kernel.git/Documentation/devicetree/bindings/thermal, branch linux-6.3.y

Merge tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

2023-02-24T21:31:53Z

Pull devicetree updates from Rob Herring: "DT core: - Add node lifecycle unit tests - Add of_property_present() helper aligned with fwnode API - Print more information on reserved regions on boot - Update dtc to upstream v1.6.1-66-gabbd523bae6e - Use strscpy() to instead of strncpy() in DT core - Add option for schema validation on %.dtb targets Bindings: - Add/fix support for listing multiple patterns in DT_SCHEMA_FILES - Rework external memory controller/bus bindings to properly support controller specific child node properties - Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT schema format - Add RiscV SBI PMU event mapping binding - Add missing contraints on Arm SCMI child node allowed properties - Add a bunch of missing Socionext UniPhier glue block bindings and example fixes - Various fixes for duplicate or conflicting type definitions on DT properties" * tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits) dt-bindings: regulator: Add mps,mpq7932 power-management IC of: dynamic: Fix spelling mistake "kojbect" -> "kobject" dt-bindings: drop Sagar Kadam from SiFive binding maintainership dt-bindings: sram: qcom,imem: document sm8450 dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema dt-bindings: arm: Add Cortex-A715 and X3 of: dynamic: add lifecycle docbook info to node creation functions of: add consistency check to of_node_release() of: do not use "%pOF" printk format on node with refcount of zero of: unittest: add node lifecycle tests of: update kconfig unittest help of: add processing of EXPECT_NOT to of_unittest_expect of: prepare to add processing of EXPECT_NOT to of_unittest_expect of: Use preferred of_property_read_* functions of: Use of_property_present() helper of: Add of_property_present() helper of: reserved_mem: Use proper binary prefix dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES of: reserved-mem: print out reserved-mem details during boot dt-bindings: serial: restrict possible child node names ...

dt-bindings: thermal: rcar-gen3-thermal: Add r8a779g0 support

2023-02-15T16:28:51Z

Document support for the Thermal Sensor/Chip Internal Voltage Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC. Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3 sensors, so increase the maximum number of reg tuples. Just like other R-Car Gen4 SoCs, interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by: Geert Uytterhoeven Reviewed-by: Wolfram Sang Reviewed-by: Niklas Söderlund Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be Signed-off-by: Daniel Lezcano Signed-off-by: Rafael J. Wysocki

dt-bindings: thermal: mediatek: Add LVTS thermal controllers

2023-02-15T16:28:34Z

Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195. Signed-off-by: Balsam CHIHI Reviewed-by: Rob Herring Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com Signed-off-by: Daniel Lezcano Signed-off-by: Rafael J. Wysocki

dt-bindings: thermal: tsens: add per-sensor cells for msm8974

2023-01-16T10:22:30Z

The msm8974 platform uses two sets of calibration data, add a special case to handle both of them. Acked-by: Krzysztof Kozlowski Signed-off-by: Dmitry Baryshkov Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: tsens: support per-sensor calibration cells

2023-01-16T10:22:30Z

Allow specifying the exact calibration mode and calibration data as nvmem cells, rather than specifying just a single calibration data blob. Note, unlike the vendor kernel the calibration data uses hw_ids rather than software sensor indices (to match actual tsens usage in thermal zones). Signed-off-by: Dmitry Baryshkov Reviewed-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: tsens: add msm8956 compat

2023-01-16T10:22:30Z

When adding support for msm8976 it was thought that msm8956 would reuse the same compat. However checking the vendor kernel revealed that these two platforms use different slope values for calculating the calibration data. Add new compatible for the tsens on msm8956 SoC. Acked-by: Krzysztof Kozlowski Signed-off-by: Dmitry Baryshkov Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7

2023-01-16T10:22:30Z

The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the new compatible for TM7 differs from older TM5 by allowing configuring per sensor decimation, time measurement and number of sample averaging - unlike one configuration per entire device. This was not reflected in the bindings, therefore comment the new compatible as incomplete as it might change and its ABI is no stable. Signed-off-by: Krzysztof Kozlowski Acked-by: Rob Herring Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: Fix node descriptions in uniphier-thermal example

2022-12-26T22:09:29Z

Prior to adding dt-bindings for SoC-dependent controllers, rename the thermal node and its parent node to the generic names in the example. And drop a parent node of the thermal-sensor as it is not directly necessary. Signed-off-by: Kunihiko Hayashi Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com Signed-off-by: Rob Herring

dt-bindings: drop redundant part of title (manual)

2022-12-16T18:51:43Z

The Devicetree bindings document does not have to say in the title that it is a "Devicetree binding" or a "schema", but instead just describe the hardware. Manual updates to various binding titles, including capitalizing them. Signed-off-by: Krzysztof Kozlowski Acked-by: Alexandre Belloni Reviewed-by: Jonathan Cameron Acked-by: Ulf Hansson # MMC Acked-by: Stephen Boyd # clk Acked-by: Dmitry Torokhov # input Acked-by: Mark Brown Acked-by: Viresh Kumar # opp Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org [robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml] Signed-off-by: Rob Herring

dt-bindings: drop redundant part of title (end, part three)

2022-12-16T17:41:49Z

The Devicetree bindings document does not have to say in the title that it is a "binding", but instead just describe the hardware. Drop trailing "bindings" in various forms (also with trailing full stop): find Documentation/devicetree/bindings/ -type f -name '*.yaml' \ -not -name 'trivial-devices.yaml' \ -exec sed -i -e 's/^title: $.*$ [bB]indings\?\.\?$/title: \1/' {} \; Signed-off-by: Krzysztof Kozlowski Acked-by: Alexandre Belloni Acked-by: Matti Vaittinen # ROHM Acked-by: Ulf Hansson # MMC Acked-by: Stephen Boyd # clk Acked-by: Dmitry Torokhov # input Acked-by: Mark Brown Acked-by: Hans Verkuil # media Acked-by: Sebastian Reichel # power Acked-by: Viresh Kumar # cpufreq Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org Signed-off-by: Rob Herring